Recently, the China Semiconductor Industry Association, China Electronics News and two other units jointly selected 36 items in the Fourth Chinese semiconductor innovative products and technology. The SSJ-100 ultrasound scanning microscope which was invented by No. 45 Research Institute of China Electronics Technology Group Corporation won this award.

SSJ-100 ultrasound scanning microscope is an apparatus for off-line test and analysis. Because of its great advantages, it can be widely used in failure analysis, process development, monitoring of key production processes and low-volume product test. As an innovative product, it is under relevant patent protection in several aspects such as construction and analysis of ultrasound images, ultrasound transmitting and receiving devices, etc. Moreover, it has independent intellectual property rights of the core technology. With the help of the product, non-destructive testing and visual analysis can be carried out on a variety of defects, which are internal injuries and discontinuity of semiconductor device during packaging. Therefore, the internal injuries and manufacturing process of MEMS can be tested and analyzed. In addition, it can focus on the characteristics analysis of many types of materials such as ceramics, glass and metal. In a word, it fills the gap in the relevant field in China.

Compared with the X-ray on the aspect of non-destructive testing, ultrasound scanning microscope can show all internal defects within the adhesive layer, fill layer, and the bonding layer. As a new technology of non-destructive testing, it takes the dominant place. The product is not only a reliable guarantee during production process, but also an effective method of reducing the cost of production.